Well no, your comment answered that we need training because the dies are made cheaply. But no amount of money would prevent the need to train out static and dynamic delays. If it wasn't in the controller it'd be in the memory and the question of why it's needed would still be relevant.

You need to train whether you're on one die or 100. It's about your per bit skew and PVT

It's so weird to focus on the hypothetical scenario of this impacting corporate environments? This is the first good feature Windows has announced (at least on paper for desktop) in recent history and the author is concerned that what, people will play video games at work because of it? As if Minesweeper and Solitaire and people saying "can you repeat that I was multitasking" don't exist already?

And as per usual with journalism I disagree on the set of information provided. They mention the Ally as having received this feature. But they don't say how well it did or didn't do on there. The link if basically just another press release about this feature from back even it was announced, so there should be either benchmarks or a note that 9 months later they still haven't released the feature.

TIL fuses vs fuzes

Can't comment on the wire bonding quality but yes you're not supposed to sonic wash anything with an oscillator. This includes ultra and mega sonic. I had always thought it was because you could damage the crystal or mems structures, so color me surprised to see this failure mode, though there still could be a shift in frequency that the scoping wasn't able to see.

I tried looking at an exemplar ECS tcxo datasheet and didn't see anything in there about washing which is surprising but it also doesn't say not to crush it with a hammer so maybe it was assumed. That's bad on them.

As for SMA to 0.1" headers: yes these are very cursed. But RF designers love putting SMAs for every connector on an eval board (power, enable, whatever) and those come in handy.